{
    "version": "1.0",
    "type": "rich",
    "width": 0,
    "height": 0,
    "html": false,
    "provider_name": "ReleaseWire",
    "provider_url": "http:\/\/www.releasewire.com\/",
    "title": "Global IC Advanced Packaging Equipments Market 2017: ASM Pacific, Applied Materials, Kulicke & Soffa, BESI Inc, Advantest, Hitachi High-Technologies, Teradyne",
    "author_name": "Market Research Store",
    "author_url": "http:\/\/www.marketresearchstore.com\/"
}